Arlon 85N Material
Arlon 85N is a pure polyimide laminate and prepreg system, offering the ultimate high-reliability solution, with significantly less PTH failure, delamination, or board degradation compared with FR-4, high-performance epoxies, or other high-performance materials.
ARLON 85N is a flame-retardant thermoset composite, Arlon 85N is a true rigid Polyimide material specifically designed for high-frequency and high-temperature applications. Arlon 85N offers several advantages over traditional PCB materials, such as FR4.
One of the main advantages of ARLON 85N is its improved thermal performance. The material has a higher glass transition temperature of TG=260 degrees Celsius almost double that of standard FR4 materials, which allows it to withstand higher operating temperatures. This is particularly important for applications that generate a lot of heat, such as power electronics, and can help to extend the life of electronic components and improve the overall performance of the PCB.
Another advantage of ARLON 85N is its improved mechanical strength. The material is highly durable and has a low coefficient of thermal expansion (CTE) at 16, which makes it less prone to warping or cracking at high temperatures. This can help to improve the reliability of the PCB, especially for applications that require a high level of mechanical stability, such as aerospace and military applications.
ARLON 85N also offers improved electrical performance. The material has a low dielectric constant and loss tangent, which helps to reduce electromagnetic interference (EMI) and improve signal integrity. This is particularly important for high-frequency and high-speed applications, such as telecommunications and networking.
In addition to these advantages, ARLON 85N also offers a number of cost benefits. The material is less expensive than other high-performance materials, such as ceramic or specialty ROGERS materials, which can help to reduce the overall cost of the PCB. Additionally, the improved thermal performance of ARLON 85N can help to reduce the cost of cooling systems, which can further reduce the overall cost of not only the bare PCB but more importantly efficiency of the final product.
ARLON 85N is widely used in applications such as power electronics, aerospace, aircraft, military, automotive, and industrial controls that require high thermal stability and reliable performance at high temperatures. It is also widely used in high-frequency and high-speed applications, such as telecommunications and networking, where its low dielectric constant and loss tangent can help to improve signal integrity.
Typical features and advantages of Arlon 85N are:
*Low in-plane (x,y) expansion of 6-9 ppm/°C allows attachment of SMT devices with minimal risk of solder joint failure due to CTE mismatch.
* Random fibre organic reinforcement guarantees outstanding dimensional stability and reduced misregistration for improved multilayer yields.
* Decomposition temperature of 407°C, compared with 300-360°C for typical high-performance epoxies, offering outstanding high-temperature lifetime performance.
* Up to 50% or more reduction in cure time compared with competitive products.
* Electrical and mechanical properties meeting the requirements of IPC-4101/40 and /41
* Toughened, Non-MDA chemistry is more resistant to cracking during drilling
* Non-halogenated chemistry – Halogen Free Material, ideal for Radioactive applications.
* RoHS/WEEE compliant For more information on design and fabrication of your next high-performance PCB with ARLON 85N Material, please don’t hesitate to contact the team at sales@pcbglobal.com